The laboratory is equipped for the experimental analysis of displacements, deformations and stresses using three-dimensional, two-dimensional and reflection photoelasticity techniques, Shadow Moiré, 2D and 3D Digital Image Correlation (DIC), on macro and microscopic scales, including the ability to measure deformations on the scale of the microstructure of materials, strain measurement techniques using electrical resistance strain gauges and fiber optic strain gauges, displacement measurements using transducers, residual stress measurement, stress measurement using the Thermoelastic Stress Analysis (TSA) technique, as well as the ability to detect defects and measure fatigue properties using infrared imaging techniques. The laboratory has the necessary equipment for casting and manufacturing three-dimensional models, photoelastic ovens for fixing optical anisotropy and polariscopes for analyzing the models, as well as hardware and software for DIC, TSA and infrared imaging analysis.
Location: Pilotis of the Cardeal Leme Building
Contact: Renato Bichara Vieira – renatovieira@puc-rio.br
Support: CNPq and CAPES